COB binding processing for PCBA one stop service
PCB circuit board bonding (bonding) is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the chip with gold or aluminum wires to the package pins or the gold-plated copper foil of the circuit board before packaging.
The ultrasonic wave (generally 40-140KHz) of the transducer generates high-frequency vibration through the transducer, and is transmitted to the wedge through the horn. When the wedge is in contact with the lead wire and the welded part, it will wait under pressure and vibration. The surface of the weld metal rubs against each other, the oxide film is destroyed, and plastic deformation occurs, causing the two pure metal surfaces to come into close contact, reaching a bond of atomic distance, and finally forming a strong mechanical connection. Generally, after bonding (that is, after the circuit and the pins are connected), the chip is packaged with black glue.
The company has a number of ASM 520A, 530 and other automatic bonding machines, advanced production equipment, excellent management team, dedicated to providing customers with efficient and high-quality services. Process focus: When cleaning the PCB circuit board, wipe the oil, dust, and oxide layer on the position of the state with a skin, and then wipe the test position with a brush or blow it with an air gun. When applying adhesive glue, the amount of glue drop is moderate, and the glue dots are evenly distributed at the four corners. The adhesive glue must not contaminate the pad. When chip sticking (solid crystal), vacuum suction pen is used, and the suction nozzle must be flat to avoid scratching the surface of the chip. Check the direction of the chip. When sticking to the PCB, it must be "smoothly and positively". The chip and the PCB are attached to the PCB in parallel and there is no virtual position. The chip and PCB are not easy to fall off during the whole process. The direction of the chip must not be reversed.
When bonding wire, the PCB of bonding has passed the bonding tensile test, 1.0 wire is greater than or equal to 3.5G, and 1.25 wire is greater than or equal to 4.5G. When bonding a standard aluminum wire with a melting point, the wire tail is greater than or equal to 0.3 times the wire diameter and less than or equal to 1.5 times the wire diameter, and the shape of the aluminum wire solder joint is oval. The length of the solder joint is greater than or equal to 1.5 times the wire diameter and less than or equal to 5.0 times the wire diameter. The width of the solder joint is greater than or equal to 1.2 times the wire diameter and less than or equal to 3.0 times the wire diameter. The bonding process should be handled with care, and the points must be accurate. The operator should observe the bonding process with a microscope to see if there are any defects such as broken bonding, winding, offset, hot and cold welding, and aluminum. To notify the relevant technical personnel to solve in time. Before the formal production, there must be a special person for the first inspection to check whether there are any errors, few or missing states. In the production process, there must be a dedicated person to check its correctness at regular intervals (up to 2 hours). Before installing the plastic ring on the chip, check the regularity of the plastic ring to ensure that its center is square without obvious distortion.
When installing, ensure that the bottom of the plastic ring is closely attached to the surface of the chip, and the photosensitive area in the center of the chip is not blocked. . When dispensing, the black glue should completely cover the PCB sun ring and the aluminum wire of the bonding chip, and no wire can be exposed. The black glue can not seal out the PCB sun ring. The leaked glue should be wiped off in time. The black glue cannot penetrate the chip on.
During the glue dispensing process, the needle tip or the wool swab must not touch the surface of the chip in the plastic ring or the bonding wire. The drying temperature is strictly controlled: the preheating temperature is 120±5 degrees Celsius and the time is 1.5-3.0 minutes; the drying temperature is 140±5 degrees Celsius and the time is 40-60 minutes. The surface of the dried vinyl shall not have pores or uncured appearance, and the height of the vinyl shall not be higher than the plastic ring. The test generally adopts a combination of multiple test methods, such as manual visual inspection, automatic wire bonding quality inspection of bonding machines, and automatic optical image analysis (AOI) X-ray analysis to check the quality of inner solder joints.
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PCB manufacture equipment list:
OEM/ODM Services
We provide one-stop PCB/PCBA customization services. To meet all of customer's PCB/PCBA requirement is MICRO POWER circuit service's goal
FAQ
Q1: What service do you have?
We provide turnkey solution including electronic product R&D, PCB fabrication, PCB assembly,SMT, final assembly,function testing ,tooling mould design,housing assembly ,other value-added service.
Q2: What are the main products of your PCB/PCBA services?
Our PCB/PCBA services are mainly for the industries including Medical, Automotive, Energy, Metering/Measurements, Consumer Electronics.
Q3: Is MICRO POWER a factory or trade company?
We are the factory with PCB factoryand SMT assembly factories China
Q4: Can we inspect quality during production?
Yes, we are open and transparent on each production process with nothing to hide. We welcome customer inspect our production process and check in house.
Q5: How can we ensure our information should not let third party to see our design?
MICRO POWER: We are willing to sign NDA effect by customer side local law and promising to keep customers data in high confidential level.
Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third parties.
Q6: What does MICRO POWER need for a customized PCB order?
When you place a PCB order, the customers need to provide Gerber or pcb file. If you do not have the file in the correct format, you can send all the details related to the products.
Quantity,and Techenic requirements(material,surface finish treatment, copper thickness,board thickness ,...)
Q7: What does MICRO POWER need for a customized PCBA order?
When you place a PCBA order, you need to provide Gerber or pcb file and the BOM list ,Testing documentsto us.
Q8. What file formats do you accept for production?
Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF,word,txt)
Q9. MOQ?
There is no MOQ in MICRO POWER.We are able to handle Small as well as large volume production with flexibility.
Q10.Shipping cost?
The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the shipping cost.
Q11.The price of PCB and the price of the whole order
Due to limitations, the system can only provide you with the approximate price of PCB board, but your project also includes other costs: mold fee, test fee, engineering fee, etc. So please contact us before placing the order, and we will provide you with an accurate quotation according to your PCB parameters and quantity!
If you have any questions, we are 24 hours online.
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