The purpose of Pattern electroplating is to increase the copper thickness of the lines and holes (mainly the copper thickness of holes) to ensure their electrical conductivity and other physical properties.According to the performance requirements of different plates from different customers, the copper thickness of hole wall is generally between 0.8Mil-1.2miL (plate layer + graph layer), and the distribution of plate layer and graph layer is determined by the characteristics of plates.
Basic process of Pattern plating: a certain line is formed after the board is exposed and developed by laminating. Pattern plating is selective thickening of copper surface that is not covered by dry film.The main flow of the pattern electroplating is as follows (depending on different washing conditions, it can be one or two channels) : feed plate -- oil removal -- wash -- microetching -- wash -- acid leaching (sulfuric acid) -- electroplating copper -- wash -- acid leaching (fluoroboric acid) -- electroplating (lead) tin -- wash -- exit plate -- deplating (etching fixture) -- wash -- feed plate